DRIE expands from MEMS to advanced packaging and more applications

May 15, 2012 — Deep reactive ion etching (DRIE) is a structuring process originally used to make micro electro mechanical systems (MEMS). This process enables achieving etch depths of 100s of micrometers with almost vertical sidewalls with very high aspect ratio (> 50:1 in some cases). The process was first developed by Robert Bosch, and thus it is also called the

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