Hanking builds MEMS fab in China

May 4, 2012 — Hanking Industrial Group Co., Ltd., broke ground on a micro electro mechanical system (MEMS) manufacturing campus in Fushun City, China, outside of Shenyang, in late March.

Photo. Yang Min, chairman of the board (fourth from left) led some executives of the Hanking Group to participate in the groundbreaking ceremony for a new MEMS fab.

The MEMS sensor manufacturing venture will lead the way for the company’s high-tech development strategy. Hanking Industrial is primarily a mining and metals processing company. Once completed, the Hanking Micro Electro Mechanical Sensor Industry Park project will bring in RMB 10 billion, and may form a local industry on the scale of RMB 100 billion, the company reports.

The industrial park is designed based on advanced, international standards, said Yang Min, chairman of the board. Late in 2011, Hanking MEMS’ leader Dr. Douglas Ray Sparks met with Wang Guifen, Mayor of Fushun City, Deputy Mayor Zhang Wenhui, director of Fushun Economic Development Zone Management Committee Dong Zebin, leaders of Municipal Science and Technology Bureau, Development and Reform Commission, and Foreign Trade and Economic Bureau, president of Hanking Group Yu Wenbo, president of Hanking MEMS Company Huang Xiangxiang, CFO of Hanking Group Li Yongshan, and Administrative and HR director Chen Zhe. The meeting covered the plan for the MEMS site and economic impact of the facility.

Hanking Industrial Group Co., Ltd. is active in mining, metallurgy, commerce, electronics, and precision manufacturing.Learn more at http://www.hanking.com/.

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...