Invensas debuts high-I/O PoP semiconductor packaging design May 22, 2012 — Invensas Corporation, a wholly owned subsidiary of Tessera Technologies Inc. (NASDAQ:TSRA) and provider of semiconductor technologies, debuted bond via array (BVA) technology, an ultra-high-I/O semiconductor packaging alternative to wide-I/O through silicon via (TSV) packaging. BVA offers package performance for mobile electronics in the established package-on-package (PoP) architecture with copper wire bonds for stack interconnects. PoP designs package die and stack packages, instead of stacking die within a package with TSVs or other technologies. BVA PoP enables reduced pitch and a higher number of interconnects in the PoP perimeter stacking arrangement. It has demonstrated scalability to a 0.2mm pitch. It takes PoP from 240 pins to 1200 pins. BVA PoP suits applications processor + memory device stacks, increasing processor-to-memory bandwidth. Simon McElrea, president of Invensas, says the PoP structure could enable higher resolution, faster frame rate video streaming, faster search, higher-resolution multi-screen, multi-application operation, more life-like gaming and high-resolution 3D applications — all requirements of mobile devices. McElrea noted that the PoP structure of BVA is a cost-effective semiconductor assembly method to achieve these high performance requirements in a small form factor. The ultra-high I/O offered by BVA exceeds what is possible with solder ball stacking and solder-filled laser via approaches, Invensas says. Invensas will present its BVA PoP solution at the Electronic Components and Technology Conference (ECTC) at the Sheraton San Diego Hotel and Marina in San Diego, CA. Titled "Fine Pitch Copper PoP for Mobile Applications" the paper will be part of Session 31, "Applications With 3D Technology," at 4:45 PM on Friday, June 1, 2012. Invensas will also exhibit at ECTC in booth 107 on May 30 and 31, 2012. Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq:TSRA), acquires, develops, and monetizes strategic intellectual property (IP) in areas such as circuitry design, memory modules, 3-D systems, and advanced interconnect technologies, to serve the dynamic mobile, storage and consumer electronics sectors. Internet: www.invensas.com. Visit the Advanced Packaging Channel of Solid State Technology, and sign up for our Advanced Packaging News e-newsletter!