JEDEC creates LED test standards series

May 23, 2012 — Microelectronics standards developer JEDEC Solid State Technology Association created a series of standards, JESD51-5x, for component-level testing of high-brightness/power light-emitting diodes (LEDs). JESD51-5x targets thermal characterization of power LED components and is in compliance with the International Commission on Illumination (CIE)’s existing LED measurement recommendations.

The standards were developed with LED industry leaders in JEDEC’s JC-15 Committee. LED manufacturers and assembly/packaging/test providers will use the new standards.

Efficiency of power LEDs is in the range of 20-40%, and these devices are increasingly used as a lighting source. The design process requires accurate thermal data for LED components. LED lifetime expectancy and light output are dependent on proven thermal design. The JESD51-5x series of standards were developed to give credence to expected lifetime and light output information on LEDs.

Also read: Cree LED test suite TEMPO 24 incorporates IES LM-79

JESD51-5x offers clear recommendations for which data to include on LED data sheets, as well as test environments and procedures defined specifically for power LEDs, removing ambiguity about how thermal performance of an LED package or a metal core printed circuit board (MCPCB) assembled LED device is identified.

The new standards will be featured in a presentation at CORM’s (Council for Optical Radiation Measurements) May 31 event in Ottawa, Canada. Dr. Andras Poppe of Mentor Graphics and Budapest University of Technology and Economics, and a key author of the new standards within JC-15, will present “New JEDEC thermal testing standards for high power LEDs.” For more information visit:

JEDEC is a leading developer of standards for the microelectronics industry. JESD51-50, 51, 52 and 53 are all available for free download via the JEDEC website:

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...