SATS provider Carsem begins LED packaging and test

May 4, 2012 — Semiconductor packaging and test services provider Carsem will assemble and further develop light-emitting diode (LED) packaging technologies, partnering with a key customer.

Carsem has begun assembling and qualifying high-brightness silicon-substrate LED arrays and will ramp high-volume, full turn-key manufacturing services, including electrical testing, laser mark, and tape-and-reel, in early 2012.

To enable standard mass production, Carsem deployed matrix substrate design; auto die attach, wire bond, and high reflection coating dispense; compression molding through an automold system; substrate-mapping; and bin sort per test mapping on the LED packages.



Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>


Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...