Murata completes VTI Technologies buy, announces Murata Electronics Oy

May 28, 2012 – BUSINESS WIRE — VTI Technologies, a leading manufacturer of 3D micro electro mechanical system (MEMS) sensors that has formed part of Murata since January 2012, is now Murata Electronics Oy.

Following the acquisition of VTI Technologies Oy by the Japanese company Murata Manufacturing, VTI has recently changed its company name. The new company name is Murata Electronics Oy. At the same time, the company has adopted Murata’s visual identity with the Murata logo.

"The change of company name and visual identity clearly and strongly highlights the fact that this company is now an integral part of Murata," said Tsuneo Murata, president of Murata Manufacturing. "Our aim is to strengthen the Murata brand worldwide, and this change supports our strategy. VTI has been recognized as a pioneer in MEMS technology, and now we want Murata to be the top-of-mind name also for high-quality MEMS sensors, in addition to other Murata products."

Shinji Ushiro, the new CEO and president of Murata Electronics Oy as of 1 June, added that Murata’s objective is to become one of the main global MEMS companies. "By exploring the market needs and by developing competitive MEMS products, we believe that we can reach this objective."

With the new company name, a new website has also been launched for Murata MEMS sensors: www.muratamems.fi. The website presents MEMS accelerometers, inclinometers and gyroscopes, as well as MEMS sensor elements (die) manufactured by Murata Electronics Oy — the former VTI.

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules, power supply modules and MEMS sensors. For more information, go to www.murata.com.

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...