3D and 2.5D Integration: A Status Report Live Event

Die stacking enables better chip performance in a small form factor, meeting the needs of smartphones, tablets, and other advanced devices. Though-silicon vias (TSVs) are moving into volume packaging production, as manufacturers work to solve challenges with reliability, cost and scaling. 2.5D, where interposers of silicon or glass are used, is seen as an intermediary step before full-blown 3D. This webcast will explore the present status of 2.5 and 3D integration, including TSV formation.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...
Edwards launches new Smart Thermal Management System at SEMICON Europa 2016
10/25/2016Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by red...