Advantest tackles 3D package test with new product line June 8, 2012 – BUSINESS WIRE — Advantest Corporation (TSE:6857, NYSE:ATE) is developing a line of fully automated and integrated test and handling solutions for through silicon via (TSV)-based 2.5D and 3D packages. The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities. The concept test cell solution will be designed for die handling, test, and production line integration. From wafer to known good die (KGD) and known good stack (KGS), the DIMENSION concept shows the direction of 2.5D and 3D production-capacity, specification performance, and yield. 2.5D and 3D-stack technologies offer improvements to density, power and performance. The DIMENSION concept addresses challenges with delicate and thin die handling, active thermal management, and overall yield management with SmartDieCarrier (SmtDC) technology. SmtDC solutions provide die pick & place plus very fine pitch contact with both extreme precision and delicate soft touch handling. And Active Thermal Control (ATC) with real time power management achieves yield and specification compliance. Advantest makes automatic test equipment (ATE) for the semiconductor industry and manufactures measuring instruments. More information is available at www.advantest.co.jp Learn more about 2.5D/3D packaging technology developments in our report from The ConFab: 3D and 2.5D semiconductor packaging technologies Visit the Advanced Packaging Channel of Solid State Technology, and sign up for our Advanced Packaging News e-newsletter!