ConFab interview: Bill Tobey on EUV lithography

June 6, 2012 — Bill Tobey, president of ACT International Consulting, speaks about the evolution of extreme ultra violet (EUV) lithography with Solid State Technology editor-in-chief Pete Singer at The ConFab 2012, an invitation-only meeting of the semiconductor industry.

 

EUVL needs more time, because the fundamental questions and challenges with EUV have not been resolved.

The node at which EUVL enters the semiconductor manufacturing line will impact the lithography tools. EUV could be inserted at the 16nm node, certainly below 20nm, and possibly at 8nm.

We may go back to photo optics, Tobey said, and directed self-assembly and imprint lithography are other options. The certain fact, Tobey said, is that there is a future for lithography.

See more about lithography from The ConFab 2012:

ConFab interview: Dai Nippon Printing’s Naoya Hayashi

Turning the technology knobs for system scaling

Visit the Semiconductors Channel of Solid State Technology!

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....