ConFab interview: Dai Nippon Printing’s Naoya Hayashi

June 5, 2012 — Naoya Hayashi, research fellow for electronic device operations at Dai Nippon Printing, speaks with Solid State Technology chief editor Pete Singer during The ConFab 2012. Hayashi presented “NGL Mask Readiness” in The ConFab’s session on technology trends for advanced semiconductor manufacturing.

The ConFab is Solid State Technology’s invitation-only meeting for the semiconductor industry, taking place this week in Las Vegas, NV.

 

More ConFab stories:

Semiconductors in the smart society: Next-generation connectivity

Turning the technology knobs for system scaling

How to prevail over silicon cycles

Semiconductor industry experts look to the future

A virtual IDM concept

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...