Fast-curing conductive chip-attach adhesive meets RFID packaging needs

June 20, 2012 — DELO introduced the DELOMONOPOX AD268 epoxy resin to meet the low-cost, reliable-attach needs of radio frequency identification (RFID) device makers. The anisotropic, electrically conductive adhesive provides fast cure at chip attach, and is designed for flip-chip RFID packaging, as well as other packaging applications.

DELOMONOPOX AC268 reliably bonds chips, which measure down to 400

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