June 28, 2012 — An annual guide for navigating the micro electro mechanical systems (MEMS) events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.
To get a sense of the scope of MEMS developments and trends, read Paula Doe’s preview articles, MEMS manufacturing changes with HV consumer apps and Maturing MEMS sector looks at ways to work together
TUESDAY, July 10, 10:30am-3:30pm
Taking MEMS to the Next Level: Transitioning to a Profitable High-Volume Business
Presented in cooperation with MEMS Industry Group (MIG)
We’ve expanded the MEMS program to all day this year, and invited speakers from around the world to address practical potential solutions to the major manufacturing issues for growing the sector to the next level. Yole Développement’s J.C. Eloy will give his views on the future of the industry and what it will take to get there. Harmeet Bhugra will talk about IC maker IDT’s entry into the MEMS timing business. Doug Sparks from the new Chinese MEMS IDM Hanking Electronics talks about the opportunities in the China market. Foundry executives Donald Robert from Teledyne Dalsa and Peter Hrudey from Micralyne examine possible collaborative solutions to speed time-to-market. Hillcrest Labs CTO Charles Gritton talks about issues of software integration and sensor fusion.
On the manufacturing technology side, Coventor’s Matt Kamon tells us what’s coming next in MEMS design automation software, Applied Materials’ Mike Rosa talks about next-generation DRIE and other new processes being developed specifically for MEMS production, ‘and Nikon’s Jumpei Fukui discusses the advantages of mini-steppers. In addition, Finnish startup ScanNano’s CEO Andrei Pavlov presents his work making low-cost cavities without etching and NIST’s Janet Cassard introduces standard reference materials and best practices for consistent characterization and troubleshooting of processes for calibrating instruments and communicating between customers and suppliers.
Location: Extreme Electronics TechXPOT at Moscone Center (South Hall). The stage is in the same place as last year, in the far back right-hand corner of the Moscone South exhibit hall.
WEDNESDAY July 11, 5:00-7:00pm
MIG Happy Hour
Save the date and time. MIG will host its annual Happy Hour at SEMICON West. Invitations will be sent soon.
THURSDAY, July 12, 10:30am-12:30pm
MEMS and Sensor Packaging
The SEMI Packaging Committee presents a program focusing on MEMS packaging technology issues, featuring Analog Devices’ Asif Chowdhury on issues of packaging MEMS for industrial applications, and Yole Développement’s Jerome Baron on the roadmap for MEMS packaging going forward. Florian Solzbacher from the University of Utah’s Utah Nanofabrication Laboratory presents on biomedical packaging issues, while Marc Bachman from the University of California talks about the future of MEMS manufacturing.
Location: TechXPOT North, Moscone Center (North Hall)
THURSDAY, July 12, 11:45-1:00pm
Flexible Batteries and Flexible Mounting of Thinned Silicon Die on Textiles, Skin Patches and Implants
MEMS folks interested in integrating sensors into innovative wearable, flexible, implantable applications may want to check out presentations in the Plastic Electronics program on patterning flexible batteries on unconventional substrates and embedding thinned conventional silicon die into flexible polymer packaging, from companies who don’t typically show up at MEMS events. Imprint Energy talks about its low-cost, high-energy density Zn polymer battery technology suitable for wireless and wearable sensors, Applied Materials presents its lower cost technology for making thin film batteries, and MC10 describes its conformal electronics packaging targeted at wearable and implantable sensors.
Location: Extreme Electronics TechXPOT, Moscone Center (South Hall)