Conference report: IITC closes with talks from EUV to TSV

June 7, 2012 — Day 3 of the 15th IITC (International Interconnect Technology Conference) opened Wednesday, June 6 at the Doubletree Hotel in San Jose, CA under clear sunny skies and a pleasant breeze. The herd thinned a bit, down to ~150 hearty souls from the original 230 the prior two days.

Read Fury’s reports from Day 1 and Day 2 of IITC.

Subramanian Iyer of IBM started the day with an invited talk on scaling in the 3rd dimension (not to be confused with The Adventures of Buckaroo Banzai Across the 8th Dimension) and prospects for silicon interposers and 3D integration. His retrospective introduction harkened back to IBM

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...