June 19, 2012 — Plasma etch and deposition processing system maker Oxford Instruments Plasma Technology won an order for its recently launched PlasmaPro Estrelas100 deep silicon etch tool from the University of Toronto.
The PlasmaPro Estrelas100 deep silicon etch tool offers flexibility for R&D uses. It forms nano and micro structures via Bosch and cryo etch technologies in the same chamber. It performs smooth sidewall processes and high-etch-rate cavity etches without changing the chamber hardware.
UToronto will use the system in its Emerging Communications Technology Institute (ECTI) in the central micro- and nanofabrication facility, serving academic research and development needs, as well as training functions. Professor Yu Sun, Director of ECTI, cited the PlasmaPro Estrelas100’s equipment quality, performance and capabilities, as well as system support.
The PlasmaPro Estrelas100 will be used for collaborative research with strategic partners in key research areas, including nanotechnology and nanofabrication, photonic materials and devices, micro- and nano-electromechanical systems (M/NEMS), biotechnology, micro- and nano-electronic devices, integrated optics, and photovoltaic devices.
The Canada Foundation for Innovation (CFI) funded the purchase and commissioning of important tools including deep reactive ion etch (DRIE) and other tools for the Centre for Microfluidic Systems in Chemistry and Biology.
Oxford Instruments provides high-technology tools and systems for research and industry. The company designs and manufactures equipment that can fabricate, analyze and manipulate matter at the atomic and molecular level. Learn more at www.oxford-instruments.com.