June 22, 2012 — SEMICON West is taking place July 10-12 at the Moscone Center in San Francisco, CA. Following are new products for semiconductor packaging and test that will be at the show, from wafer bonders to LED die attach materials.
Automated temporary bonding/debonding system
The EVG850 TB/DB XT Frame from EV Group is an automated temporary bonding and debonding system for thin wafer handling, configured to address high-volume 3D IC and TSV manufacturing. The system temporarily bonds a device wafer to a rigid carrier wafer for safe and efficient processing of the device wafer. After subsequent processing (back thinning, lithography, metallization, etching, through via processing, etc.), the device wafer is debonded from the carrier substrate using various techniques dependent of the intermediate material. The system can be configured for LowTemp debonding methods like ZoneBOND technology with the required EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules. A thermal-activated, mechanical slide-off is utilized for thermo-plast materials, while UV-exposure and lift-off debond is utilized for UV-activated tapes. It accommodates up to 9 process modules and boasts a continuous-mode operation with an ultra-fast handling system, up to 4 FOUP load ports, a material buffer in the form of a local FOUP storage system holding up to 10 additional FOUPs, and in-line metrology module option. EV Group, South Hall, Booth 719.
Electrochemical deposition tool
TEL NEXX’s new plating tool, Stratus Thunder, is used for electrochemical deposition of TSV, middle and interposer, lead-free, copper pillar, and RDL advanced packaging materials. Stratus Thunder features a low-cost vertical plating architecture and additional features improve its productivity by up to 50%. TEL, South Hall, Booth 1531.
The MAX-800 is a large format, high speed X-Y-Z spray coating system designed for the thin, uniform application of a variety of coatings and suspensions used in semiconductor packaging, display manufacturing, fuel cell manufacturing and medical device manufacturing applications. The system features USI