June 26, 2012 — Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report, airing live tomorrow at noon EST/9AM PST. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.
3D and 2.5D Integration: A Status Report will cover through-silicon via (TSV) formation, interposers, and other die stacking methods. What is the present status of these advanced packaging technologies?
Przybus will present