Epson launches high-throughput IC test handler for volume test

July 2, 2012 — Seiko Epson Corporation (TSE: 6724) launched the NX1032XS pick-and-place IC test handler, boasting high throughput for transferring, inspecting, and sorting semiconductors in downstream processes.

The IC test handler transfers finished semiconductors to inspection equipment for electrical, visual and other final performance tests, then sorts them by good/defective or other parameters. It transfers, inspects, and sorts up to 20,000 ICs per hour.

With the ability to transfer 32 semiconductors to inspection equipment at a time, this new model offers twice the capacity of Epson’s previous top model, the NS-8160W. Epson also uses its original Smart Motion Control robot control technology to enable fast movement while maintaining low vibration when transferring semiconductors. In addition, the plate can be heated to enable testing at extreme temperatures of up to 155

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...