EVG’s wafer bonder passes SEMATECH/ISMI 3D integration tool assessment

July 11, 2012 – PRNewswire – SEMICON West — International consortium SEMATECH qualified the GEMINI automated wafer bonding system from EV Group (EVG) through its systematic, rigorous Equipment Maturity Assessment (EMA) implemented within SEMATECH’s 3D Interconnect program and ISMI’s EMA team. The assessments of several tools are designed to determine equipment readiness for high-volume manufacturing (HVM) of 3D integration technologies. EVG

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