EVG’s wafer bonder passes SEMATECH/ISMI 3D integration tool assessment

July 11, 2012 – PRNewswire – SEMICON West — International consortium SEMATECH qualified the GEMINI automated wafer bonding system from EV Group (EVG) through its systematic, rigorous Equipment Maturity Assessment (EMA) implemented within SEMATECH’s 3D Interconnect program and ISMI’s EMA team. The assessments of several tools are designed to determine equipment readiness for high-volume manufacturing (HVM) of 3D integration technologies. EVG

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....