Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants

July 18, 2012 – BUSINESS WIRE — Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC).

The room-temperature product encapsulates ball-grid array (BGA) and land-grid array (LGA) semiconductor packages, with encapsulation quality and connectivity to match compounds that must be stored in a frozen state.

The room-temperature state of Kyocera

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

2 thoughts on “Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants

  1. Sunil Bali

    Please suggest some epoxy grade of Kyocera
    Diesel Resistant
    Having Good bonding with Metal & Plastic Both
    Can withstand -40degree centigrade to 120degree Centigrade without cracking

    Reply
  2. Sunil Bali

    Please suggest some epoxy grade of Kyocera Diesel Resistant
    Having Good bonding with Metal & Plastic Both
    Can withstand -40degree centigrade to 120degree Centigrade without cracking.

    We urgently need your contact in India for Epoxy Procurement

    Reply

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

MKS introduces the I-Series family of high flow mass flow controllers
02/25/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced th...
TMC introduces stage-base 450 with voice coil technology
02/10/2015TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-m...
Entegris launches Dispense System optimized for 3D and MEMS applications
02/03/2015Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronic...