Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants

July 18, 2012 – BUSINESS WIRE — Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC).

The room-temperature product encapsulates ball-grid array (BGA) and land-grid array (LGA) semiconductor packages, with encapsulation quality and connectivity to match compounds that must be stored in a frozen state.

The room-temperature state of Kyocera

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One thought on “Kyocera room-temp epoxy molding compound competes with frozen semiconductor package encapsulants

  1. Sunil Bali

    Please suggest some epoxy grade of Kyocera
    Diesel Resistant
    Having Good bonding with Metal & Plastic Both
    Can withstand -40degree centigrade to 120degree Centigrade without cracking

    Reply

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