SUSS coating/developing platform suits MEMS, packaging, LED fab, more July 10, 2012 – BUSINESS WIRE — Semiconductor manufacturing equipment supplier SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms. The ACS200 Gen3 offers the capability to combine four wet process modules with up to 19 plates for high-volume production. State of the art offerings include open bowl spin coating and proprietary GYRSET closed cover coating technology. The configuration flexibility of modules and technologies suits production of advanced semiconductor packages, micro electro mechanical systems (MEMS) and light-emitting diodes (LEDs). The tool can also be used to bridge the gap between research & development (R&D) and high-volume manufacturing (HVM). SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.