July 6, 2012 — We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco. Be sure to bookmark our SEMICON West 2012 Channel for all the info from that show.
Focus on lithography
Dr. Vivek Bakshi, president of EUV Litho Inc., reports on the 2012 EUVL Workshop (June 4-8 in Maui, HI), where attendees shared their latest technology developments and discussed ways to address the challenges of EUVL insertion into HVM.
Dr. Vivek Bakshi, president of EUV Litho, Inc., reports on the SPIE Advanced Lithography conference. He says that this year even the loudest criticism of EUVL was not about “if” but “when,” and the predicted range of insertion for EUVL in high volume manufacturing (HVM) is now 2013-15.
After attending SPIE Advanced Lithography, Barclays Capital came away with a lower lithography tool shipments forecast, more hope for EUV lithography, and expectations of a litho buying spree at Intel.
The eBeam Initiative, a forum for new IC manufacturing approaches based on electron beam (e-beam) lithography, will unveil its latest roadmap at the SPIE Advanced Lithography Symposium.
Focus on yields/productivity
Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.
Bill Ross of ISMI and Joanne Itow of Semico report on the ConFab 2012 Executive Roundtable. Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use.
Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.
Industry leaders at the 35th annual SEMI Industry Strategy Symposium (ISS) described a perfect storm of cost, complexity and uncertainty as the industry struggles with process engineering complexity at sub-28nm nodes, hazy EUV installation schedules, 3D-IC challenges, and planning for a 450mm wafer transition, reports SEMI.
Focus on packaging
IMAPS Device Packaging’s papers were recently released, and blogger Dr. Phil Garrou shares highlights from SSEC, Asahi Glass, Hitachi Chemical, and others. He also takes a look at Fujitsu’s low temp Cu-Cu bonding technology.
With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. Amkor, GLOBALFOUNDRIES, ASE, and Xilinx’s presenters offer ideas.
The 15th IITC took place in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back-end memory, blogger Michael Fury reports.
A main focus of this year’s Electronic Components and Technology Conference (ECTC), held in San Diego, was 3D integration and TSVs, blogs Pete Singer, editor-in-chief.
Focus on emerging technologies
Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe in Zurich, Switzerland.
Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights: electronic skin, energy storage with nanowires, printable inks, gas sensing, inkjet printing, semiconductor polymers for organic devices, CNTs, OFETs, touch screen fabrics, and the coffee breaks.
SensorsCon 2012 was held March 21 at the Santa Clara TechMart Center, in conjunction with the annual meeting of the ISQED. This is the first such meeting focusing on sensor technology, with about 60 attendees. As a design conference, the focus was more on system design and architecture, reports Fury.
Guangzhou (China) Lightfair Conference is the biggest lighting fair in Asia. Citi analyst Timothy Arcuri notes trends in LED manufacturing and pricing ahead of China’s subsidy program going into effect.