Ziptronix wafer bonding technology adopted for high-volume cellphone component

July 17, 2012 — Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.

The high-volume consumer application will benefit from cost savings and efficiency of Ziptronix DBI wafer stacking, the company says. The wafer bonding technology can offer smaller pitch, increased functionality, increased density and scalability, along with lower-cost manufacturing, for future generations of 3D integrated devices.

The technology saw its initial adoption in image sensor manufacturing, and is now being applied in 3D memory stacking and other applications, said Daniel Donabedian, CEO of Ziptronix. Additional licensing discussions are underway with companies targeting 3D integration, he added. Ziptronix licenses its technology throughout the semiconductor supply chain, including OEMs, IDMs and some fabrication and assembly facilities

Ziptronix develops low-temperature direct bond technology for various semiconductor applications, including backside-illuminated (BSI) sensors, RF front-ends, pico projectors, memories and 3D ICs. Ziptronix

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