ASIC developers can now access multi-project wafer runs at Tektronix Component Solutions August 8, 2012 — Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs. They will implement multi-project wafer runs for device prototyping and package development early in the design cycle. This avoids developing a complete mask set for each ASIC prior to first silicon tape-out. Collaborating early in the design also can improve time-to-packaged-device by designing for the package, external interconnects, and performance. Also read: ASIC design starts evolve into 3 SoC types The partnership helps customers especially with low-volume, high-performance devices, said Tom Buzak, president of Tektronix Component Solutions, such as aerospace and defense contractors, medical OEMs, and high-speed communications developers. Tektronix Component Solutions and MOSIS are accredited Trusted Suppliers for aerospace and defense electronics. Tektronix Component Solutions offers high-performance ASIC design on the front end and turnkey IC packaging services on the back end. Tektronix Component Solutions and MOSIS are experienced working with high-speed ASICs on silicon-germanium (SiGe) processes and other specialty semiconductors. MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. Tektronix Component Solutions is a microelectronics services provider offering custom design, prototyping, manufacturing, and test services to equipment manufacturers. Tektronix Component Solutions can be found on the Web at component-solutions.tektronix.com. Visit the Advanced Packaging Channel of Solid State Technology, and sign up for our Advanced Packaging News e-newsletter!