Hybrid Memory Cube interface specification draft includes protocol, short-reach PHY interconnection

August 15, 2012 — The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology Inc. and Samsung Electronics Co. Ltd., released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.

The industry specification will enable adopters to fully develop designs that leverage HMC

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