Wafer-level packaging start-up Deca Technologies appoints leader for Philippines

August 17, 2012 — Deca Technologies, wafer-level packaging (WLP) services to the semiconductor industry, added Iain Meikle its executive management team, as VP of operations and managing director in the Philippines.

Also read: Flooding in the Philippines threatens microelectronics facilities

Meikle joins Deca from Carsem, a semiconductor packaging and test services provider, where he was VP of manufacturing for Malaysia and China. He has almost three decades experience in the semiconductor industry, including time with leadframe maker Dynacraft Industries; GEC Plessy Semiconductors, Seagate

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