CrossFiber lands $13M funding for 3D MEMS photonics switches

September 17, 2012 – CrossFiber, a San Diego, CA maker of photonic switches that incorporate microelectromechanical system (MEMS) technology, says it has completed the final tranche of a Series D round of funding, which closes totaling $13.4 million. Southern Cross Venture Partners led the funding round, with participation from New Venture Partners and Arsenal Venture Partners, as well as existing investors including Back Bay Management and PacifiCap.

The majority of the funds has been and will be used to rapidly expand manufacturing capacity for CrossFiber’s LiteSwitch family of photonic switches, according to the company. The LiteSwitch photonic switches combine 3D MEMS micro-mirrors on silicon, non-invasive beam steering (NIBS), and custom ASICs, for application in data centers and fiber-optic switching. The company says its proprietary methods create precisely positioned fiber and microlens arrays, yielding collimator arrays with good beam shape and low insertion loss.

Visit the MEMS Channel of Solid State Technology, and subscribe to our MEMS Direct e-newsletter!

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...