Axcelis signs $30M fab tool management contract for chipmakers’ US sites October 2, 2012 - Axcelis Technologies said it has signed a five-year $30M contract with "one of the world’s leading semiconductor manufacturers" to support its implant, cleaning, and thermal processing equipment at multiple fabs in the US. Under the deal, the company will manage "a range of programs to enhance system productivity and capital efficiency, including all aspects of tool maintenance, spare parts and consumables management and reporting." The deal is part of Axcelis’ Global Support Solutions program, which is geared toward optimizing manufacturing performance throughout the fab cycle. "This program is part of a growing industry trend to outsource management of manufacturing equipment, as customers strive to meet the demands of next generation chip production," stated Eric Paulik, VP of the global service solutions unit. "We’re pleased to be able to help this industry leader maximize the return on their equipment investment." Visit the Semiconductors Channel of Solid State Technology, and sign up for our WaferNEWS e-newsletter!