Intermolecular, GlobalFoundries, IBM stepping to 10nm node

October 2, 2012 – Intermolecular says that it is working with both GlobalFoundries and IBM to speed development of manufacturing technologies down to the 10nm node, using its High Productivity Combinatorial (HPC) technology.

The firm had already publicly revealed it was working with GlobalFoundries down to 14nm process technologies, which it announced at SEMICON West in 2011. Now it’s confirming this work is extending down to 10nm, about as leading-edge as it gets in today’s semiconductor manufacturing capabilities. Also notable is the public acknowledgement that IBM is part of this 10nm development work as well.

"IBM and, GLOBALFOUNDRIES are committed to pushing forward the leading-edge of IC logic manufacturing with new materials and device structures," stated Gary Patton, VP of semiconductor research for IBM. "Intermolecular’s HPC technology will help to more rapidly explore materials and processing options for advanced logic manufacturing."

"Our business model is built on collaboration, both in customer engagements and technology development. Collaborating with Intermolecular has strengthened our R&D pipeline and improved R&D efficiency," added David Bennett, VP of alliances for GlobalFoundries.

Visit the Semiconductors Channel of Solid State Technology, and sign up for our WaferNEWS e-newsletter!

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...