Will the $2 interposer be silicon or glass?

Many of the world’s 3D IC elite met last week at the 2nd annual Georgia Tech 2.5D Interposer Conference which focused on the technology and performance of silicon and glass interposers.

Matt Nowak of Qualcomm, long a 3D advocate, reported that Qualcomm has now built "thousands of parts" and does not see anything stopping high-volume manufacturing (HVM) except cost. Nowak indicates that Qualcomm will require a price of ~ $2 for a 200mm2 silicon interposer. The former is just out of the reach of those proposing "coarse" interposer fabrication, and the latter is significantly out of the pricing structure for dual damascene foundry-based fine interposers

Nagesh Vordharalli of Altera quoted an IMEC study which shows that the sweet spot for maximum bandwidth will come from interposers with RDL lines/spaces ~ 3

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...