IEDM 2012 slideshow 01

Intel’s 22nm trigates for SoCs

Multiple-gate transistors provide superior on/off control, enabling high drive currents to be achieved at a lower supply voltage than otherwise. At the International Electron Devices Meeting (IEDM), Intel will discuss its use of the multiple-gate approach to build a complete and versatile 22nm 3D tri-gate transistor technology platform for a range of system-on-chip (SoC) applications. The high-speed logic transistors have subthreshold leakages ranging from 100-nA/μm, while the low-power versions feature leakage of <50 pA/μm yet have drive currents 50% higher than 32nm planar devices. The process also yields high-voltage transistors (1.8V or 3.3V) with the highest reported I/O device drive currents for an SoC technology (NMOS/PMOS=0.92/0.8 mA/μm at 1.8V). The trigate technology platform features eight to 11 layers of low-k and ultralow-k carbon-doped oxide (CDO) interconnect at tight pitches for different applications. (#3.1, "A 22nm SoC Platform Technology Featuring 3-D Tri-Gate and high-k/Metal Gate, Optimized for Ultra-Low-Power, High-Performance and High-Density SoC Applications")

 

MIMCAP developed for 22nm trigate process.

<<<     PREV      1  2  3  4  5  6  7  8  9  10  11  12  13  14     NEXT     >>>>

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...