IEDM 2012 slideshow 05

Hybrid floating gate nonvolatile memory

imec will describe — for the first time — a demonstration of ultra-thin hybrid floating gate (HFG) planar NVM cell performance and reliability. Results not only confirm the high potential of the HFG thickness scaling down to 4nm with improved performance, but also show excellent post cycling data retention and P/E cycling endurance. The optimized ultra-thin HFG planar cells show potential for manufacture and scalability for high density memory application. The stack consists of an ISSG tunnel oxide, a dual layer FG (PVD polysilicon + PVD TiN), a high-k IPD (ALD Al2O3) and an n-type polysilicon CG. (#2.2: "Ultra Thin Hybrid Floating Gate and high-k Dielectric as IGD Enabler of Highly Scaled Planar NAND Flash Technology")

 

XTEM of a Ge-channel FET with SiGe source/drain.

<<<     PREV      1  2  3  4  5  6  7  8  9  10  11  12  13  14     NEXT     >>>>

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....
Radiant Zemax announces ProMetric Y series compact imaging photometers
06/18/2014Radiant Zemax, a provider of light and color test and measurement systems, announces the release of the ProMetric Y line of imagin...
Chad Industries will demonstrate world-class flexible automated wafer handling for 450mm wafers at SEMICON West 2014
06/12/2014Chad Industries, owned by Jabil Circuit, Inc., announced today that it will demonstr...