IEDM 2012 slideshow 10

TSV-based 3D power distribution

Researchers from IBM and Rensselaer Polytechnic Institute will report on a partition and assembly approach that combines both the electromagnetic (EM) and analytical simulations to accurately model and analyze several TSV-based 3D power delivery networks, which are composed of stacked-chips, interposer, and package substrate. With this method, they for the first time consider RLC couplings between multiple voltage supply rails in 3D systems. The quantitatively examined power performances, they say, unveil 3D power delivery design implications to fulfill 3D integration benefits. (#30.6: "Hybrid Modeling and Analysis of Different Through-Silicon-Via (TSV)-Based 3D Power Distribution Networks")

 

Two of the 3D power network architectures (not in scale) used in this work.

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