RF Trends

The RF chips presented at ISSCC 2013 confirm that RF devices will continue to see larger levels of integration at the chip- and package- level for years to come.

This year has shown increased innovation, integration and technical maturity across RF frequency bands. ISSCC authors will present on an ongoing drive toward increasing levels of integration. This trend can be seen in all areas of RF design from mm-Wave, to cellular, to imaging, to wireless sensors. Subcommittee chair Andreia Cathelin of STMicroelectronics in Crolles, France discusses these trends. Read more.

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