RF Trends

The RF chips presented at ISSCC 2013 confirm that RF devices will continue to see larger levels of integration at the chip- and package- level for years to come.

This year has shown increased innovation, integration and technical maturity across RF frequency bands. ISSCC authors will present on an ongoing drive toward increasing levels of integration. This trend can be seen in all areas of RF design from mm-Wave, to cellular, to imaging, to wireless sensors. Subcommittee chair Andreia Cathelin of STMicroelectronics in Crolles, France discusses these trends. Read more.

<<<     PREV      1  2  3  4  5  6  7     NEXT     >>>>

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....