Singapore IME launches 2.5D silicon interposer MPW

December 19, 2012 - Singapore’s Institute of Microelectronics (IME), a research institute of the Science and Engineering Research Council of the Agency for Science, Technology and Research (A*STAR), has launched a new multiproject wafer service (MPW) for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.

The 2.5D interposer MPW service, supported by IME’s 3D through-silicon via (TSV) engineering line, includes the following modules:

  • Leveraging industry standard Electronic Design Automation (EDA) tools to perform 2.5D TSI design, extraction and verification;
  • TSV with critical dimension (CD), e.g. 10-50

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...