Dow launches CMP polishing pads from IKONIC platform

Following the introduction of its IKONIC chemical mechanical planarization (CMP) polishing pad platform in late 2012, Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), launched the first pads from its new IKONIC 2000 and IKONIC 3000 polishing pad series. All pads in the IKONIC CMP polishing pad platform are designed for use at the 28nm manufacturing node and below, with IKONIC 2000 polishing pads targeting copper barrier, HKMG and buffing applications, and IKONIC 3000 polishing pads developed initially for use in bulk copper polishing.

The first of the new pads, IKONIC 2020H, achieves defectivity levels significantly lower than traditional pads while maintaining removal rate. Additionally, every pad in the IKONIC 2000 series is formulated to be easily conditioned for optimal texture and longer pad life time. This improves polishing consistency and lowers overall cost of ownership.

IKONIC 3040M is the first polishing pad in the IKONIC 3000 series. This pad delivers a significant reduction in scratch defects compared to other bulk copper pads. Additionally, IKONIC 3040M demonstrates improved topography performance and lower cost of ownership. This pad is available in a range of configurations and options for multiple applications.

Samples are currently available and in beta testing with multiple customers.

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