Digi-Key Corporation and MEMSIC announce global distribution agreement

Global electronic components distributor Digi-Key Corporation today announced the signing of a global distribution agreement with MEMSIC, a provider of MEMS sensor components, sophisticated inertial systems, and leading-edge wireless sensor networks.

“As technology tries to fit more and more functionality into smaller and smaller spaces, MEMS has grown exponentially in utilization,” said Mark Zack, Digi-Key Vice President, Global Semiconductor Product. “By integrating IC and MEMS functionality, MEMSIC offers our customers a unique product to fill a growing need in their designs. We are pleased to partner with MEMSIC.”

MEMSIC designs and manufactures integrated micro-electromechanical sensors (MEMS) using a standard integrated circuit (IC) manufacturing process. The company combines proprietary thermal-based MEMS technology and advanced analog mixed-signal processing circuitry into a single chip. This allows MEMSIC to produce high-performance accelerometers and other MEMS devices at substantially lower cost than most traditional processes.

"Digi-Key is recognized by design engineers worldwide for its excellent service, and for its access to readily available components they can count on for new designs,” noted John Newton, MEMSIC Vice President of Marketing. “We are excited to be partnering with Digi-Key, and believe this agreement will significantly expand MEMSIC’s global reach to design engineers looking for the latest in sensor technology."  

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

ClassOne introduces new mid-sized electroplater
07/06/2015Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice family of ≤200mm wafer electroplaters....
New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...