Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage -i.e. maintain a relative degree of “flatness” – has become more and more challenging. And, it’s not just the die that are getting thinner: substrates also have much lower profiles than ever before and balancing these conditions can be tough, especially if you don’t have the right materials.
This White Paper brought to you by Henkel.