Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage -i.e. maintain a relative degree of “flatness” – has become more and more challenging. And, it’s not just the die that are getting thinner: substrates also have much lower profiles than ever before and balancing these conditions can be tough, especially if you don’t have the right materials.

This White Paper brought to you by Henkel.





Henkel Corporation


Format: PDF
Size: 0.00



To view this White Paper, please log in or register




Register



* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone


Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

LIVE NEWS FEED

NEW PRODUCTS

DCG Systems extends circuit edit capability to the 10nm node with the introduction of OptiFIB Taipan
09/02/2015DCG Systems today announces the release of the OptiFIB Taipan circuit edit solution for the most adv...
SEMI-GAS unveils new custom-engineered ultra high purity liquid push system
09/02/2015The fully automatic system, operated by a GigaGuard PLC controller, features an intuitive 9” color touchscreen and user-def...
Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...