Flip Chip Devices get Flat and Happy

Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage -i.e. maintain a relative degree of “flatness” – has become more and more challenging. And, it’s not just the die that are getting thinner: substrates also have much lower profiles than ever before and balancing these conditions can be tough, especially if you don’t have the right materials.

This White Paper brought to you by Henkel.





Henkel Corporation


Format: PDF
Size: 0.00



To view this White Paper, please log in or register




Register



* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
* Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone
* Type of organization/company
* What is your primary job function?
* Company size
* Annual Sales Volume


Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...