IBM Fellow Subu Iyer to give keynote address at The ConFab 2013

Solid State Technology is pleased to announce Subu Iyer, IBM Fellow, will be giving the keynote address at The ConFab 2013 in Las Vegas on Tuesday, June 25, 2013. Iyer will speak on orthogonal scaling to fill today’s fabs in the future.

“Semiconductor technology development is at an inflection point where the historical expectations for node-to-node productivity are difficult to maintain,” Iyer writes in his abstract. “This slowing down of classical scaling is an opportunity to explore alternatives ways of leveraging both our technology and existing fab infrastructure. This talk will ask some tough questions on what we can really expect from recent technological innovations such as Hi K gate dielectrics and FINFETs in the future and what some other constraints are. We will explore the addition of orthogonal features to existing technologies that will enhance them significantly. Fabs of the future will be more diverse, offer a variety of novel capabilities, be more intimately tied to their clients whether they are captive or not, and will have to be a bigger part of the overall systems’ supply chain.”

Subramanian S. Iyer is an IBM Fellow at the Systems and Technology Group, and is responsible for technology strategy and competitiveness, embedded memory and three-dimensional Integration. He obtained his B.Tech at IIT-Bombay, and Ph.D. at UCLA. His key technical contributions have been the development of the world’s first SiGe base HBT, electrical Fuses, eDRAM and 45nm technology used at IBM and IBM’s development partners. His current technical interests and work lie in the area of 3-dimensional integration for memory sub-systems and the semiconductor roadmap. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012.

For more information on The ConFab 2013 or to register, visit The ConFab section of our website.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...