Implementation of next-generation device technology to be discussed at The ConFab 2013

Solid State Technology is excited to announce that Mark Thirsk, managing partner at Linx Consulting, will be discussing the cost and technology needed to implement next-generation device technology at The ConFab 2013. Thirsk has over 20 years of experience in the chemical industry, working with a variety of materials and processes utilized in wafer fabrication.

“Planar CMOS logic and DRAM and NAND Flash memories are all facing major challenges for future scaling,” writes Thirsk, in his abstract. “This presentation will discuss the new fully depleted transistors, such as FDSOI and FinFETs that are now entering production for logic devices. New memory technologies such as MRAM, PCRAM and FeRAM are beginning to enter production for memory as well.”

Thirsk plans to review forecasts of implementation timing for the new technologies, scaling, equipment and materials requirements, and wafer costs. Additionally, he will review the cost and process complexity implications due to the delayed migration to EUV, the introduction of 450mm wafers, the migration of deposition to vapor phase processes, and novel cleaning and CMP processes.

Having been on both sides of the fence as a user and seller of materials and equipment, as well as being intimately involved with major materials manufacturers, Thirsk is well placed to bring clarity and insight into understanding markets from both a technical and commercial perspective. Previous to Linx, Mark was Senior Marketing Manager at Rohm and Haas Electronic Materials where he was responsible for strategic planning and new business development. Additionally, Mark has served in the SEMI Chemicals and Gases Manufacturers Group (CGMG) since 1999, acting as Chairman from 2001 to 2003.

For more information or to register for The ConFab 2013, visit The ConFab section of our website.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...