Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its CA-105 Low-Cost Conductive LED Die Attach Adhesive for attaching LEDs and other small semiconductor die to silver and copper lead frames.
EMS CA-105 is approximately half the cost of a pure silver filled die attach adhesive, has a high glass transition temperature (Tg) to facilitate wire bonding small die, has low extractable ionics and high adhesion to silver and copper lead frames. CA-105 has a dispensing open time (pin transfer) greater than 24 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for pin transfer or needle dispensing.
CA-105 is the latest addition to Engineered Material Systems’ line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines.