Quartz Imaging introduces automated measurement for semiconductor images

It can be very time-consuming for engineers to measure the various features of an X-SEM image of a semiconductor device. These manual measurements of trenches, pillars, lines and spaces can also be inaccurate and there is frequently inconsistency between how engineers do the manual measurements. The collection of data is often very time-consuming as well.

With the new PCI-AM (Automated Measurement) module engineers simply click inside the feature and the measurement is done automatically with increased accuracy and consistency among all engineers. The measurement results are displayed on the image and in a spreadsheet grid. The data in the grid can be easily exported into a CSV file suitable for importation into other software such as Microsoft Excel. The images and data can also be easily included in standard Quartz PCI reports with just a few clicks.

Quartz Imaging has worked closely with semiconductor companies since it was founded in 1993, including the development of the Failure Analysis LIMS system (FA-LIMS) and is in the process of developing a LIMS system for semiconductor Reliability Labs (REL-LIMS). Quartz Imaging has more than 2,000 customers in 38 countries utilizing our industry leading solutions for Digital Image Acquisition and Processing (for most image producing instruments including SEMs, TEMs, STEMs, Tabletop SEMs, Cameras, PC Based Instruments, Scanners); 21 CFR Part 11 Compliance; Laboratory Information Management Systems (LIMS); Instrument Access Control; Instrument Remote Control; Automated Inspection Systems for Nanotechnology; X-ray Microanalysis (EDX/EDS) Systems and more.

 

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