Global semiconductor sales outpace last year through Q1 of 2013

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, announced that worldwide sales of semiconductors reached $23.48 billion for the month of March 2013, an increase of 1.1 percent from the previous month when sales were $23.23 billion. Global sales for March 2013 were 0.9 percent higher than the March 2012 total of $23.28 billion, and total sales through the first quarter of 2013 were 0.9 percent higher than sales from the first quarter of 2012. All monthly sales numbers represent a three-month moving average.  

“Through the first quarter of 2013, the global semiconductor industry has seen modest but consistent growth compared to last year,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “Sales have increased across most end product categories, with memory showing the strongest growth. With recent indications that companies could be set to replenish inventories, we are hopeful that growth will continue in the months ahead. Regionally, the Americas slipped slightly in March after a strong start to the year, but Asia Pacific and Europe have seen impressive growth recently.” 

Year-over-year sales increased in Asia Pacific (6.9 percent) and Europe (0.7 percent), but decreased slightly in the Americas (-1.5 percent) and sharply in Japan (-18 percent), reflecting in part the devaluation of the Japanese yen. Sales in Europe increased by 5.7 percent compared to the previous month, the region’s largest sequential monthly increase since March 2010.  Sales also increased from the previous month in Asia Pacific (1.7 percent), but fell in Japan (-1.6 percent) and the Americas (-1.9 percent).

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...