IEDM announces 2013 call for papers

The 59th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking original work in microelectronics research and development. The paper submission deadline is Monday, June 24, 2013 at 23:59 p.m. Pacific Time.

Special Focus Sessions at the 2013 IEDM will include bioMEMS, analog devices and circuits, advanced semiconductor manufacturing, and terahertz devices. Overall, increased participation is sought this year in circuit and process technology interaction, energy harvesting, bio-sensors and bioMEMS, power devices, magnetics and spintronics.

The 2013 IEDM will take place at the Washington Hilton Hotel December 9-11, 2013, preceded by a full day of Short Courses on Sunday, Dec. 8 and 90-minute afternoon tutorial sessions on Saturday, Dec. 7. Also, building on the popularity of the inaugural Entrepreneurs Luncheon held at last year’s IEDM, the event will be held once again, on Wednesday, Dec. 11.

The world’s best scientists and engineers in the field of microelectronics from industry, academia and government will gather at the IEDM to enjoy a technical program of more than 220 presentations, along with panels, special sessions, Short Courses, IEEE/EDS award presentations and other events spotlighting more leading work in more areas of the field than any other conference. Papers in the following areas are encouraged:

  • Circuit and Device Interaction
  • Characterization, Reliability and Yield
  • Display and Imaging Systems
  • Memory Technology
  • Modeling and Simulation
  • Nano Device Technology
  • Process and Manufacturing Technology
  • Power and Compound Semiconductor Devices
  • Sensors, MEMS and BioMEMS

 For registration and other information, interested persons should visit the IEDM 2013 home page at


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>


Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...