Multitest announces ecoAmp for high-power applications

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its ecoAmp high power Kelvin contactor successfully passed a challenging evaluation for an automotive application at a European based IDM. The patent pending ecoAmp is a solution for high-power applications of 1000+ amperes.

The ecoAmp specifically responds to the challenging requirements of high voltage/high current test. All typical packages and modules for power applications are covered by the ecoAmp, including MOSFETs, drivers, IGBTs, power modules, and power packages such as TO, SO and DIP.

In order to achieve equal current symmetry over I/Os within the contactor, the contacting resistance is held low and stable. Resistance stability is influenced by the contact spring itself AND the condition of the device pin. The ecoAmp is designed for an electrical performance of 500+ amperes with an inductance of 1.0 nH and below for 0.5 mm pitch.

The high power contactor allows for testing at the full temperature range from -60°up to 175°C, which is a standard requirement for automotive applications. The ecoAmp is able to stand the high thermal stress and support temperature stability during test. Thermal energy dissipation requires thermal management within the contactor.

“We received very positive feedback from this customer about the results of the evaluation in the HVM environment,” said Gerhard Gschwendtberger, business unit manager. “The ecoAmp leverages our long-term experience in the automotive market for the new requirements of high power applications for automotive as well as energy efficiency, energy harvesting and green energy applications.”

Multitest ecoAmp

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...