Spectra-Physics introduces industrial picosecond laser

Spectra-Physics, a Newport Corporation brand, introduces Spirit ps 1040-10, an industrial-grade picosecond laser for precision micromachining applications. The new laser delivers high finesse with exceptional beam quality (M2< 1.2), high stability (<1% rms over 100 hours), and short pulse widths (13 ps). The laser is also highly flexible with user-adjustable repetition rates from single shot to 1 MHz and an integrated pulse picker for fast pulse selection and power control. With >10 W average power, the laser is ideal for precision picosecond micromachining applications such as semiconductor and LED manufacturing, flat panel display processing, thin film ablation, and nano structuring.

“The Spirit ps laser’s precise beam shape, pulse duration, and energy translate into high-precision application results,” says Herman Chui, senior director of product marketing for Spectra-Physics. “Combined with its flexibility in repetition rate and pulse energy, this rugged industrial laser is ideal for a wide range of critical picosecond micromachining applications.”

Spectra-Physics’ Spirit ps 1040-10 laser is based on the field-proven Spirit industrial ultrafast laser platform. With high quantities of deployed systems in demanding 24/7 applications, this rugged product platform has consistently demonstrated high reliability.

The new Spirit ps 1040-10 laser will be featured at LASER World of Photonics in Munich, Germany, May 13-16, 2013.

Newport Corporation is a global supplier of advanced-technology products and systems to customers in the scientific research, microelectronics manufacturing, aerospace and defense/security, life and health sciences and precision industrial manufacturing markets. 

Spirit picosecond industrial laser

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...