Surface Cleaning and Preparation

Wet cleaning remains the most applied process step in semiconductor device manufacturing to achieve acceptable yield during continuous downscaling. Traditionally, cleaning process challenges are focused on the removal of particulate, metallic and organic contamination and the removal or growth of thin passivating films. These processes are typically based on the know-how of classical silicon processes, from which a large portion was transferred over the last years from batch to single wafer process tools. This transfer was also driven by the transition to larger wafer sizes, demanding additional efforts regarding uniform wafer processing and effective substrate wetting and drying. Furthermore, the downscaling introduces new device geometries and materials different from silicon.

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps.  An additional challenge is that the reduction in device size and an increase in device topography makes the removal of small particles even more challenging.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

One thought on “Surface Cleaning and Preparation

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Dynaloy unveils safer cleaners
11/19/2014In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy LLC is launching three...
Entegris' VaporSorb filter line protects advanced yield production
10/21/2014Entegris, Inc. today announced a new product for its VaporSorb line of airborne molecular contamination (AMC) filters. ...
Next-generation nanoimprint lithography technology
10/21/2014EV Group (EVG) today introduced its SmartNIL large-area nanoimprint lithography (NIL) process....