eMemory, an embedded non-volatile memory (eNVM) provider, and United Microelectronics Corporation, a global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory’s one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC’s 28nm process. The agreement will broaden the foundry’s specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.
eMemory President Dr. Rick Shen pointed out, "We are happy to take our important strategic partner UMC to a higher level. We stand by our core principles of ‘embedded wisely, embedded widely,’ as we incorporate our core technologies into UMC’s process platforms. This represents the integration of the strengths of both companies and will allow us to provide our IC design clients eNVM platforms that boast quality and reliability, thereby enabling them to stay ahead of the rest of the market."
eMemory’s eNVM technologies target a wide range of applications in mainstream consumer electronics, including power management ICs for smart phones and tablet computers, advanced LCD drivers, touch panel controllers, battery management, sensor controller, audio codec, and near field communications. The current silicon IP (SIP) include NeoBit, NeoFuse, NeoMTP, NeoFlash, and NeoEE, making eMemory the top provider in the industry for providing a full array of SIP products for both OTP and MTP eNVM technologies.
eMemory’s MTP technology can be applied for different product needs including <10 times programming, low-medium or medium-high densities with high endurance requirements, and multiple-time-programmable embedded non-volatile memory technology applications. Furthermore, the technologies are highly compatible with logic processes for different process generations, making eMemory an ideal partner for wafer foundries seeking seamless eNVM integration into their process platforms.
UMC is a global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC’s foundry solutions allow chip designers to leverage the company’s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States.
eMemory was established in August, 2000, and has focused on logic process eNVM silicon IP development. eMemory currently has about 200 employees.