Boston Semi Equipment announces expansion of front and back end equipment business

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility. The new location provides space for the company’s increasing workforce, a test floor for the reconfiguration of current generation semiconductor test equipment and customer test cell optimization, a temperature controlled environment for front end fab tool inspections and increased storage space for the company’s inventory of ready-to-ship semiconductor manufacturing equipment.

 “Our company has continued on a steady growth path since its founding in 2010,” stated Bryan Banish, Boston Semi Equipment CEO. “Our new location increases the company’s capacity to reconfigure and refurbish equipment to support our expanding business. We are able to configure and work on more systems in parallel, reducing our already short lead times and increasing our ability to quickly deliver large orders to meet our customers’ capacity requirements.”

 “Semiconductor manufacturers have come to rely on Boston Semi Equipment when they need to add capacity,” added Colin Scholefield, EVP Boston Semi Equipment. “We have established a reputation for quick response to their capacity needs. Whether they need equipment from OEMs or reconfigured equipment from the secondary market, BSE has the solution. This new facility will definitely aid us in keeping up with the increasing demand for our equipment solutions.”

Boston Semi Equipment currently has operations in Burlington, Mass., Tempe, Ariz., the Philippines, Japan, Taiwan and Singapore, providing products and services for both front and back end semiconductor processes.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...
Astronics Test Systems announces new PXIe test instruments
01/24/2017Astronics Corporation, through its wholly-owned subsidiary Astronics Test Systems, introduced two new test instruments today. ...