Mold Compound Advances Require World-Class Capability

Designed to encapsulate today’s high-performing semiconductor components, transfer mold compounds deliver critical device protection and performance stability. Indeed, they are essential materials and require expertise to formulate and manufacture, particularly when it comes to the performance needed for modern IC’s and power discretes that run at higher voltages in power management applications. Designing mold compounds that can endure in-field stresses and challenging environments takes world-class facilities, a knowledgeable team, the latest production resources and an innovation program that ensures materials for future technology requirements.

This Technology Paper brought to you by Henkel.





Henkel Corporation


Format: PDF
Size: 120.00K



To view this White Paper, please log in or register




Register



* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone


Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

NEW PRODUCTS

MKS introduces the I-Series family of high flow mass flow controllers
02/25/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced th...
TMC introduces stage-base 450 with voice coil technology
02/10/2015TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-m...
Entegris launches Dispense System optimized for 3D and MEMS applications
02/03/2015Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronic...