Mold Compound Advances Require World-Class Capability

Designed to encapsulate today’s high-performing semiconductor components, transfer mold compounds deliver critical device protection and performance stability. Indeed, they are essential materials and require expertise to formulate and manufacture, particularly when it comes to the performance needed for modern IC’s and power discretes that run at higher voltages in power management applications. Designing mold compounds that can endure in-field stresses and challenging environments takes world-class facilities, a knowledgeable team, the latest production resources and an innovation program that ensures materials for future technology requirements.

This Technology Paper brought to you by Henkel.





Henkel Corporation


Format: PDF
Size: 120.00K



To view this White Paper, please log in or register




Register



* Denotes required fields
* Email Address
* Your Password
* Re-Type Your Password
* First Name * Last Name
* Job Title * Company
* Address
Address 2
* City *State/Province
* ZIP Postal Code
* Country
* Phone


Please re-type the text shown below to complete your registration:



By clicking "Submit", you are indicating that you have read and agree with our Terms & Conditions and Privacy Policy.

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....