Thursday, Nov 21, 2013 at 2 p.m. ET
Register here: https://event.webcasts.com/starthere.jsp?ei=1025476
Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.
Moderated by Pete Singer, Editorial Director
Mark your calendars!