Next Generation Metrology and Inspection

Thursday, Nov 21, 2013 at 2 p.m. ET

Register here: https://event.webcasts.com/starthere.jsp?ei=1025476

Continued scaling and more complex device structures, including FinFETs and 3D stacking, are creating new challenges in metrology and inspection. Smaller defects must be detected and analyzed on an increasingly diverse set of materials. Chip makers are looking for better wafer edge inspection techniques, higher resolution metrology tools, 450mm-capability and new compositional analysis solutions. Experts will describe new approaches for next generation metrology and inspection, including measurements of CDs, stress, film thickness and non-visual defects.

Speakers:
lercel_highMike Lercel, Senior Director for Nanodefectivity and Metrology at SEMTECH

 

 

 

AlainDieboldAlain Diebold, Executive Director at the Center for Nanoscale Metrology SUNY College of Nanoscale Science and Engineering

 

 

 

Moderated by Pete Singer, Editorial Director

Mark your calendars!

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